EVG 610 Mask Aligner

The EVG 610 aligner is a UV exposure tool designed for contact and proximity (up to 1 mm) exposure on up to 200 mm wafers and 5”, 7”, and 9” photomasks. The aligner utilizes a collimated UV LED light source to expose a previously coated photoresist selectively with the aid of a chromium plated photomask. The UV light from the aligner transfers the photomask pattern into the photoresist by altering the solubility of the exposed photoresist. The photoresist is then exposed to an alkaline developer solution, rinsed and then dried. Depending on whether the photoresist was positive (exposed areas dissolve more readily) or negative, the pattern left behind will either match the mask (for positive photoresist) or will be the inverse (or negative) of the mask image.