EVG501 Bonder

Description

The EVG501 is a highly flexible manual wafer bonding system that can handle 150mm substrate sizes. This tool accommodates 6” size glass and silicon wafers. The easy access bond chamber and tooling design allows for quick and easy retooling for different wafer sizes and processes with a conversion time of less than 5 minutes.

A flag system utilized to keep the two substrates separated as seen in the photo below.

Techniques
  • Wafer bonding
Documents and manuals
ASU Unit
Knowledge Enterprise
Rates
Service ASU rate Nonprofit/other academic rate Notes
Equipment use $40/hour $48/hour  
We welcome industry customers! Contact us to find out our current rates.