GEN II Solvent Tool

Description

Wet chemical processes
Wafer cleaning is commonly the first step and may be used repeatedly throughout a process fabrication sequence. This may involve the use of acid and basic solutions, followed by a water rinse.

This is a fully Automated Bench.  Set up to run BOE (100:1) in the Etch tank and DIW QDR in the Second tank.  IPA Vapor Dry is the final step.  Etch times can be adjusted and the rinse times are adjustable although the Vapor Dry times are not adjustable.

This tool is to be run by FEDC personnel only.

Wet chemical etching is available with the following chemicals:     

  1. Buffered oxide etch (BOE = NH4F + HF) and HF solutions (such as 100 parts H2O + 1 part 49%HF)   
  2. DI H20 QDR Tank
  3. IPA Vapor Dryer
Techniques
  • Wafer cleaning
ASU Unit
Knowledge Enterprise
Rates
Service ASU rate Nonprofit/other academic rate Notes
Equipment use $50/hour $60/hour  
We welcome industry customers! Contact us to find out our current rates.