Semiconductor Device Processing

Advanced Electronics and Packaging

Semiconductor Device Processing Advanced Electronics and Packaging Equipment and Rates AM3200 Pulse IV and Pulsed S-Parameter Characterization System

AM3200 Pulse IV and Pulsed S-Parameter Characterization System

Description

The integrated AM3200 Pulse IV and Pulsed S-Parameter characterization platform provides advanced on-wafer measurement capabilities for RF, microwave and power semiconductor devices. The system combines fast pulsed biasing with high-performance vector network analysis and precision wafer probing for accurate characterization under quasi-isothermal operating conditions.

The AM3200 Pulse IV system enables synchronized gate and drain pulse generation, allowing device characterization while minimizing self-heating effects. Pulsed IV measurements support compact model extraction, trapping analysis and reliability evaluation.

The Rohde & Schwarz ZNA26 vector network analyzer provides high-accuracy S-parameter measurements from 10 MHz to 26.5 GHz. When synchronized with the pulsed bias system, the platform enables pulsed S-parameter characterization of active devices under realistic operating conditions.

The FormFactor Summit 200 probe station with thermal chuck supports measurements from -60 C to 300 C, enabling temperature-dependent device characterization and model validation.

 

Typical measurements

  • Pulsed I-V curves
  • S11, S21, S12, S22 parameters
  • Transconductance and output conductance
  • Current collapse and trapping effects
  • Temperature-dependent RF performance
  • Gain, stability, and matching characteristics
  • Equivalent circuit extraction

Applications

  • GaN HEMT characterization
  • RF transistor modeling
  • Power amplifier development
  • Semiconductor process development
  • University and industrial research
  • Reliability and lifetime studies

 

Techniques

  • Pulsed I-V characterization
  • Pulsed S-parameter measurements
  • Small-signal RF characterization
  • Thermal-dependent device characterization
  • Bias-dependent S-parameter analysis
  • Compact model extraction
  • Trapping and dispersion analysis
  • GaN and SiC device characterization

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