Description
Composite Material Wafer Grinder is a mechanical grinding tool which consists of an automated FOUP handler, chuck table, Z1 (rough), and Z2 (fine) grind stations. During process flow equipment will receive wafers from FOUP and transfer from Z1 –> Z2 stations based upon programmed recipe settings to grind wafer to desired target thickness. Once completed processing wafer equipment will place wafer into output FOUP.
For using integrated wafer mounter with grinder please combine requests to ensure both equipment available.
Composite Material grinder is configurated to be able to handle 200mm or 300mm wafers.
Techniques
- Wafer Thinning
- Composite Material Thinning
