Description
The Dual model combines both the Wedge Bond and Ball Bond capabilities in one machine.
This Dual model system provides the most flexible machine for performing a variety of Bond types, making it a perfect solution for Research and Development purposes, low production volumes, and when there is a need to change from one Bond type to another.
- Ball bonding: high speed, Multi-angular/Omni-directional, mass production (general IC applications)
- Wedge bonding: high precision, high reliability, Unidirectional, lower speed (power/RF/specialized applications)
Techniques
- Wire bonding
Image Gallery
