Description
Lesker #1 Sputter tool utilizes three magnetron guns with DC or RF energy. The sputter tool currently has the ability to sputter silver (Ag), aluminum (Al), gold (Au), chromium (Cr), cobalt (Co), copper (Cu), iron (Fe), hafnium (Hf), indium tin oxide (ITO), molybdenum (Mo), nickel (Ni), Permalloy (Co/B/Zr/Ta), silicon (Si), silicon carbide (SiC), silicon dioxide (SiO2), tantalum (Ta), titanium (Ti), titanium dioxide (TiO2) and tungsten (W) target materials. The tool also has the ability to deposit dielectrics such as ITO, nickel nitride (NiN), SiO2 and TiO2. The tool has a 5.5” platen, has the ability to run reactive films and has the ability to perform a pre-argon (Ar) backsputter to pre-clean substrates. This sputter tool has restrictions for zinc (Zn) and zinc oxide (ZnO) materials.
Learn more about thin film deposition technique and associated tools.
Techniques
- Thin film deposition
Documents and manuals
Rates
| Service or material | ASU rate | Nonprofit or academic rate | Notes |
|---|---|---|---|
| Equipment use | $52.50/hr | Contact Nanofab for external rates. |
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