Description
Lesker #5 Sputter tool utilizes four magnetron guns with DC or RF energy. The Sputter tool currently has the ability to sputter aluminum (Al), chromium (Cr), molybdenum (Mo), nickel (Ni), nickel nitride (NiN), Permalloy (Co/B/Zr/Ta), silicon (Si), titanium (Ti) and tungsten (W) target materials. The tool also has the ability to deposit dielectrics such as NiN and silicon dioxide (SiO2). The tool has a 8” platen, it can run reactive films and has the ability to perform an argon (Ar) back sputter clean. This sputter tool has restrictions for materials that could contaminate Silicon such as gold (Au), silver (Ag), platinum (Pt), copper (Cu), zinc (Zn), zinc oxide (ZnO) and indium tin oxide (ITO).
Learn more about thin film deposition technique and associated tools.
Techniques
- Thin film deposition
Documents and manuals
Rates
| Service or material | ASU rate | Nonprofit or academic rate | Notes |
|---|---|---|---|
| Equipment use | $52.50/hr | Contact Nanofab for external rates. |
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