Description
The PlasmaLab M80 Plus – Chlorine is an open load reactive ion etch system. Process gases are boron trichloride (BCl3), chlorine (Cl2), nitrogen (N2), carbon tetraflouride (CF4), oxygen (O2) and argon (Ar). The system is for the etching of compound semiconductors and metals. Masks allowed in this system are photoresist and dielectrics. This tool requires pre-requisite training on other techniques: metrology.
Specs:
Wafer Size: Designed for 100 mm. 200 mm maximum. Wafers smaller than 100 mm and irregularly shaped samples can be placed directly on platen.
Platen Size: 238 mm
Power Range: < 270 Watts
MFC Flow Range:
BCl3: 0 – 100 sccm
Cl2: 0 – 50 sccm
CF4: 0 – 100 sccm
O2: 0 – 50 sccm
Ar: 0 – 100 sccm
N2: 0 – 100 sccm
Pressure Range: < 250 mTorr
Techniques
- Dry etch
- reactive ion etching
Documents and manuals
Rates
| Service or material | ASU rate | Nonprofit or academic rate | Notes |
|---|---|---|---|
| Equipment use | $52.50/hr | Contact Nanofab for external rates. |
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