Description
The PlasmaLab M80 Plus – Fluorine is an open load reactive ion etch system. Process gases are sulfur hexaflouride (SF6), triflouromethane (CHF3), carbon tetraflouride (CF4), oxygen (O2) and (Ar). The system is for the etching of silicon (Si), silicon dioxide (SiO2) and silicon nitride (Si3N4). Photoresist is the only mask allowed in this system.
This tool requires pre-requisite training on other techniques: metrology.
Specs:
Wafer Size: Designed for 100 mm. 200 mm maximum. Wafers smaller than 100 mm and irregularly shaped samples can be placed directly on platen.
Platen Size: 238 mm.
Power Range: < 270 Watts
MFC Flow Range: 0 – 100 sccm for all gases.
Pressure Range: < 250 mTorr
Learn more about dry etch deposition technique and associated tools, such as reactive ion etching.
Techniques
- Dry etch
- reactive ion etching
Documents and manuals
Rates
| Service or material | ASU rate | Nonprofit or academic rate | Notes |
|---|---|---|---|
| Equipment use | $52.50/hr | Contact Nanofab for external rates. |
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