Description
The Tegal 421 is a barrel type photoresist asher. The process gas is oxygen (O2). The system is for the for the stripping of photoresist. There are two Tegal 421 barrel ashers in the NanoFab: Tegal 1 and Tegal 2.
This tool requires pre-requisite training on other techniques: metrology.
Specs:
Wafer Size: 200 mm maximum. Wafers smaller than 200 mm and irregularly shaped samples must be placed on carriers.
Power Range: < 200 W
Pressure Range: < 500 mTorr
Techniques
- Dry etch
- reactive ion etching
- barrel ashing
Documents and manuals
Rates
| Service or material | ASU rate | Nonprofit or academic rate | Notes |
|---|---|---|---|
| Equipment use | $52.50/hr | Contact Nanofab for external rates. |
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