Description
Xactix XeF2 Si Etcher is an open load dry vapor phase etch system. The process gas is xenon diflouride (XeF2). The system is for the deep isotropic etching of silicon. Masks allowed in the system are photoresist and silicon dioxide (SiO2).
This tool requires pre-requisite training on other techniques: metrology.
Specs:
Wafer Size: Designed for 100 mm. Wafers smaller than 100 mm and irregularly shaped samples can be placed directly on platen.
Platen Size: 100 mm
Techniques
- Dry etch
- dry vapor phase etching
Documents and manuals
Rates
| Service or material | ASU rate | Nonprofit or academic rate | Notes |
|---|---|---|---|
| Equipment use | $52.50/hr | Contact Nanofab for external rates. |
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