Advanced Electronics and Photonics Integrates with Core Facilities

  • KE Core Facilities
  • 2020-04-22

We are excited to announce the integration of Advanced Electronics and Photonics (AEP) to Arizona State University's Core Facilities! AEP offers comprehensive electronics capabilities that bridge the gap between innovation and product development by providing an information-secured solution to the risk and resource concerns commonly present in exploratory electronics projects. AEP houses a wide range of processing and metrology equipment commonly found in a thin film transistor FAB.

Located in the ASU Research Park, AEP houses a wide range of processing and metrology equipment commonly found in a thin film transistor FAB.

The available metrology equipment set includes ellipsometry, reflectometry, profilometry, infrared spectroscopy, hall measurement, scanning electron microscopy, four-point probe, contact angle, film stress and defect analysis.

The processing equipment set includes photolithography, acid and base etching, reactive ion etching, downstream plasma etching, plasma enhanced chemical vapor deposition (PECVD), sputter deposition, thermal and ion beam assisted evaporation, inkjet printing, organic material spray coating, laser ablation, and substrate cleaning. AEP can also assist with photomask design, flexible substrate processing, device assembly (specifically TAB bonding), and device characterization (I-V sweeps).

The AEP Core originally existed as the Flexible Electronics and Display Center and has a long history of providing TFT fabrication services to industry. A recent industry project called for the fabrication of flexible 4.1” diagonal monochrome organic light emitting diode (OLED) display demonstrators for the demonstration of a new flexible substrate process which we implemented at the AEP for the outside vendor. The purpose of the array build was to demonstrate the survivability of the OLED device after processing through the experimental flexible substrate debond process. The still image in Figure 1 was taken shortly after all processing was complete and demonstrates that the experimental flexible substrate process was a success.