Characterization

The following characterization tools are available through NanoFab:

Tool	Technique	Measures	Samples	Beam size	Analysis
F20	Reflectance	Film thickness	Dielectrics, semiconductors, thin metals	Large spot	Multilayer optical models
F40	Reflectance	Film thickness	Dielectrics, semiconductors, thin metals	Small spot,local areas	Multilayer optical models
Woollam	Ellipsometer	Film thickness index (n & k)	Dielectrics, semiconductors, thin metals	Large spot	Multilayer optical models
Zygo	White light interference	Optical step height		Large area

Optical cleanroom metrology tools

Tool	Technique	Requires	Material
Dektak (Bruker)	Mechanical Stylus	Step in films	Any material
AlphaStep	Mechanical Stylus	Step in films

Optical microscopes: Several optical microscopes are available in NanoFab, including some with cameras for photomicrographs and line-width measuring capabilities. Additional microscopes are available outside the cleanroom (Axiophot Photomicroscope).

Field emission scanning electron microscope (FESEM)

The FESEM is located in ERC131 and includes EDAX elemental analysis capability, sample preparation, size limits and coating for non-conducting samples.

FESEM operating manual and capabilities

Electrical testing

Many processes fabricate devices or structures that will need electrical testing after completion or even during the process. The NanoFab provides probe stations for IV or CV measurements and analysis. The Agilent 4155C semiconductor parameter analyzer (SPA) has standard test routines for bipolar and MOSFET devices as well as diodes. It can measure currents from below 1pA to 100mA with some limits on power.

High temperature probe station (HT probe)

This probe station is located in ERC240 and has an Agilent 4155C semiconductor parameter analyzer (SPA) for IV measurements and an Hewlett-Packard impedance bridge for LCR measurements. The system has a thermal chuck and controller for temperature dependent measurements from -30V to +350C. Software is available to automate the measurement and data collection steps.

The following is a list of NanoFab’s characterization tools and their capabilities:

SEM

• Hitachi S4700 FESEM – Variable voltage SEM with EDX capabilities. Eucentric stage for sample sizes up to 4″ diameter.

Optical

• Filmetrics F20 and F40 – Optical reflectometer for measuring film thicknesses of dielectrics, semiconductors and thin metals
• Woollam Ellipsometer – Optical ellipsometer for measuring film thickness and determining refractive index (n & k values) of dielectrics, semiconductors and thin metals
• Zygo Interferometer – White light interferometer for measuring optical step height of materials
• Optical microscopes – Several optical microscopes are available in the NanoFab, including some with cameras for photomicrographs and line-width measuring capabilities. Additional microscopes are available outside the cleanroom (Axiophot Photomicroscope).

Physical

• Bruker Dektak profilometer – Mechanical stylus profilometer for measuring step height on films and surface morphology.
• AlphaStep profilometer – Mechanical stylus profilometer for measuring step height on films and surface morphology

Additional characterization

• The Eyring Materials Center has numerous additional analytical techniques.