Description
The Die Measurement System is designed for an automated and manual optical inspection of parts. The system is equipped with 2.5x lens with option of up to 4x digital zoom. The system allows operator to create inspection program recipes with a high degree of customization. The option to import designs from CAD is available.
The Die Measurement System is configured for handling wafers up to 300 mm.
Techniques
- Optical inspection
ASU Unit
Knowledge Enterprise
Rates
| Service | ASU rate | Nonprofit/other academic rate | Notes |
|---|---|---|---|