Advanced Electronics and Packaging capabilities

The Advanced Electronics and Packaging facility can assist with thin film processing, thin film characterization, device assembly and characterization, photolithography, etching and flexible electronics. AEP is capable of processing 2” wafers all the way up to 300 mm wafers.

Popular applications of our capabilities include microelectronic device prototyping, wafer coating or cleaning, fan-out wafer level packaging, solar cell and diode optimization, and pilot scale product demonstration. AEP is equipped with the tools and expertise to help take your electronic device from prototype fabrication to final packaging.

What is a thin film?

A thin film is a microscopically thin layer of material that is deposited onto a metal, ceramic, semiconductor or plastic base (substrate). Typically less than one micron thick, thin films can be conductive, semi-conductive or dielectric (non-conductive) and are used in myriad applications.

What are thin films used for?

Thin films are generally used to improve the surface properties of solids. Transmission, reflection, absorption, hardness, abrasion resistance, corrosion, permeation and electrical behavior are only some of the properties of a bulk material surface that can be improved by using a thin film. Thin films are used in a wide variety of electronics applications such as circuit boards for computers, photovoltaic (solar) cells and LEDs.

How are thin films made?

Thin films are applied to a substrate through a process called deposition. There are two broad categories of thin film deposition:

• Chemical deposition uses a chemical reaction to produce the thin film on the substrate. Techniques include:
  • Low-pressure chemical vapor deposition
  • Plasma enhanced chemical vapor deposition
  • Electrodeposition or electroplating
  • Epitaxy
  • Thermal oxidation
• Physical deposition uses mechanical, electromechanical or thermodynamic processes to produce the thin film. Techniques include:
  • Evaporation
  • Sputtering
  • Casting

The Advanced Electronics and Packaging facility offers the following deposition tools:

• AMAT Endura PVD
• CEE Model 300 Spin Coater
• CHA E-Beam Metal Evaporator
• CHA E-Beam/Thermal Evaporator
• Laurell WS400B Spin Coater
• MRC-603A, Mr T. Sputter System

What are thin film characterization methods?

Measurement and testing of thin films are essential to ensure that the coatings satisfy the specified technological requirements. Thin film characterization techniques analyze qualities such as thickness, composition, stress state, adhesion, optical properties, electrical conductivity and more. These techniques include ellipsometry, reflectometry, profilometry, infrared spectroscopy, X-ray diffraction, scanning electron microscopy and more.

What is ellipsometry?

An ellipsometer is used to characterize the composition, roughness, thickness, crystalline nature, doping concentration, electrical conductivity and other properties of thin films. Ellipsometry is an optical technique that measures a change in polarization as light reflects or transmits from the material being studied.

AEP specializes in thin film characterization techniques such as profile step height, film thickness measurements, film optical properties, FTIR, film stress, roughness, resistivity and crystallinity, contact angle, defect analysis, and FESEM.

We offer the following thin film characterization tools:

• Automated Optical Inspection
• Bow/Warp Tool
• CD Measurement Microscope
• Ecopia HMS-5000 Hall Measurement System
• Explorer Pro Scale
• Filmetrics F50 Reflectometer
• Jinlong PEEL Tester
• JEOL 6300F FESEM
• Keyence VK-X3000 3D Surface Profiler
• Keyence VHX-7000 Microscope
• KLA Tencor Omnimapper 4 Point Probe
• Kruss DSA20E Easy Drop Goniometer/Contact Angle Measurement
• Micro Manipulator 4060
• Park XE-150 Atomic Force Microscope
• Scanning Acoustic Microscope
• Tencor 6200 SurfScan Defect Scanner
• Tencor FLX-2350FP Stress Measurement Tool
• Tencor P-16 Profilometer
• Thermo Nicolet 6700 FTIR
• Woollam M2000 Ellipsometer

What is photolithography?

Photolithography, also known as optical lithography or UV lithography, is the standard method used to create printed circuit boards and microprocessors. Photolithography uses light to transfer a pattern from a photomask onto a light-sensitive chemical photoresist on the substrate. After the pattern has been transferred, the circuit can be created by etching away the background around the pattern, or through deposition of new material on top of the pattern.

AEP offers the following equipment that can be used for photolithography:

• 6-inch Solvent Hood
• 6 inch Wet Etch Hood
• Amerimade Acid Hood
• CEE Model 300 Spin Coater
• Cole-Parmer Hot Plate
• DYMAX 2000 UV Curing Flood Lamp
• Laurell WS400B Spin Coater
• Osiris 1204 Coater and Developer
• Heidelberg MLA-300

What is etching?

Etching is a process for removing layers of thin film or substrate around a masked pattern.

AEP is equipped to perform acid and base etching, reaction ion etching, downstream plasma etching and more with the following etching tools:

• 6-inch Solvent Hood
• 6 inch Wet Etch Hood
• Amerimade Acid Hood
• Tegal 965
• AMAT Centura AP 300mm Plasma Etcher