Description
Advanced Automated Optical Inspection (AOI) system for high-speed production inspection. Can be configured to 150mm, 200mm and 300mm wafers. Supports 200mm & 300mm whole and diced wafers on frame. System includes Specialized Software and Advanced Algorithms to detect a wide range of 2D Surface Inspection surface defects on wafer, 2D Metrology (RDL/Bump CD and overlay), 3D Metrology (RDL/Bump Height). 5X/10X/30X Inspection Magnification. 2X/5X/10X/20X High Quality Color Verification Camera for image / defect verification.
Techniques
- Defect Scanning
- Optical Microscopy
