Semiconductor Device Processing

Advanced Electronics and Packaging

Ball Attach System

Description

The Ball Attach System is designed to print flux and place balls onto a wafer. The system uses flux squeegee method to print flux through a flux print stencil.
The Ball Attach System has 200 mm and 300 mm wafer handling capability. Minimum size of balls: 0.05 mm. The system uses 750mm x 750mm flux ad ball drop stencils.

Techniques

  • Ball Attach

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