Description
Dicing Saw is a mechanical dicing saw which consistes of an automated cassette and wafer handler, mechnical dicing station, and cleaning station. During process flow workpiece within equipment is transferred from cassette to chuck table, aligned and then diced with up to 2 different blades within the equipment.
Dicing Saw is configured for handling 300mm diameter wafers or mounted workpieces on 300mm ring frame.
If workpiece mounting is needed as part of request will need to either manual mount or request mounting on Automated Wafer Mounter 300mm.
Techniques
- Mechnical Saw Dicing
