Description

The Die/Chip Attach System is designed for PnP of small dies and components with a high accuracy from a source substrate onto a target substrate. The system is equipped with front and rear gantries allowing a high degree of PnP program recipe customization. The system is equipped with integrated uplook and downlook optical cameras to ensure a high level of accuracy and defect detection.

Multiple toolsets and pick nozzles are availabe to pick dies/chips as small as 2mm x 2mm.

The pick is available from:

• Wafer ring frame
• Waffle pack
• Tape & Reel