Description
The FINEPLACER® pico 2 is a multi-purpose, manual die bonder with placement accuracy down to 3 µm. It is equipped with a high-resolution vision alignment system with adjustable illumination. By maximizing color contrast between the substrate and the component, manual alignment is simple and repeatable.
The system supports up to a 300 mm wafer.
The bonding force module has a wide range of available forces, which can handle varied components.
Different tooling can be used. Most packages will require custom tooling on a per user or per package basis.
Formic acid module is configured for use with the pico 2.
Techniques
- Flip chip bonding
- Precision die bonding
- Wafer level packaging
- Chip on glass
- Flex on board
- Chip on board
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