EVG 620 Aligner

The EVG 620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 100 mm wafers. The system safely handles thick, bowed or small diameter wafers. The EVG 620's superior alignment stage design achieves highly accurate alignment and exposure results. It has a high resolution top and bottom side split-field microscope and a Windows based user interface.

Specs:
Size: 2", 100mm, Pieces
Thickness: 0.1 - 10mm
Mask parameters: Size: max. 5"x5"; Thickness: <7mm
Alignment accuracy:

• Top side alignment: ± 1.0µm 3σ.
• Bottom side alignment: ± 1.25µm 3σ.
• Large gap alignment: Option / ± 1.5µm 3σ.

Resolution:

• Vacuum + Hard Contact ≤ 0.8 µm.
• Hard Contact ≤ 1.5 µm.
• Soft Contact ≤ 2.0 µm.
• Proximity ≥ 3.0 µm.

Exposure:

• Wave length: 350 - 450nm.
• Mercury arc lamp: 350 W.

Learn more about lithography deposition technique and associated tools.