EVG 620 Aligner


The EVG 620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 100 mm wafers. The system safely handles thick, bowed or small diameter wafers. The EVG 620's superior alignment stage design achieves highly accurate alignment and exposure results. It has a high resolution top and bottom side split-field microscopes and a Windows based user interface.

Size: 2", 100mm, Pieces
Thickness: 0.1 - 10mm
Mask parameters: Size: max. 5"x5"; Thickness: <7mm
Alignment accuracy:

  • Top side alignment: ± 1.0µm 3σ
  • Bottom side alignment: ± 1.25µm 3σ
  • Large gap alignment: Option / ± 1.5µm 3σ


  • Vacuum + Hard Contact ≤ 0.8 µm
  • Hard Contact ≤ 1.5 µm
  • Soft Contact ≤ 2.0 µm
  • Proximity ≥ 3.0 µm


  • Wave length: 350 - 450nm
  • Mercury arc lamp: 350 W

Learn more about lithography deposition technique and associated tools.

  • Lithography
ASU Unit
Knowledge Enterprise
Service ASU Internal Rate External Organizations Notes
Equipment use $46.35 per Hour Contact NanoFab


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EVG 620 Aligner