The Heidelberg MLA-150 Direct Write Lithography System is a powerful tool that enables printing at high resolutions down to 0.6um and pattern placement accuracy of ±0.5um globally and ±0.25um with localized alignment. It can handle various sizes and thicknesses of substrates, making it suitable for different applications. The MLA-150 can perform grey scale lithography and has backside alignment capabilities operating at exposure wavelengths of 375 nm or 405 nm. With a resolution of 0.8 um L/S and 0.6um semi-isolated, it can achieve precise patterning on a wide range of materials. The substrate chucks can accept pieces up to 200 mm wafers with a thickness of up to 12 mm.
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Specs:
Wavelength: 375 nm or 405 nm
Resolution: 0.8 um L/S, 0.6um semi-isolated
Registration accuracy: +- 0.5 um (global, 100x100mm), +- 0.25 um (Local, 5x5mm)
Substrate sizes: Stage can accept 5mm x 5mm up to 200mm x 200mm; up to 12 mm thickness (3mm x 3mm can be accommodated with Staff approval)
Learn more about lithography deposition technique and associated tools.
- Lithography
