Heidelberg MLA-150

Description

The Heidelberg MLA-150 Direct Write Lithography System is a powerful tool that enables printing at high resolutions down to 0.6um and pattern placement accuracy of ±0.5um globally and ±0.25um with localized alignment. It can handle various sizes and thicknesses of substrates, making it suitable for different applications. The MLA-150 uses grey scale lithography with backside alignment and operates at a wavelength of 375 nm and 405 nm. With a resolution of 0.8 um L/S and 0.6um semi-isolated, it can achieve precise patterning on a wide range of materials. The substrate chucks can accept pieces up to 200 mm wafers with a thickness of up to 12 mm.

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The MLA-150 maskless, direct-write lithography tool is used for printing resolution down to 0.6um and pattern placement accuracy of ±0.5um globally and ±0.25um with localized alignment. It is designed to handle various size and thicknesses of substrates.

Specs:
Wavelength: 375 nm and 405 nm 
Resolution: 0.8 um L/S, 0.6um semi-isolated
Registration accuracy: +- 0.5 um (global), +- 0.25 um (Local)
Substrate chucks: Stage can accept 3mm x 3mm up to 200mm x 200mm; up to 12 mm thickness

Learn more about lithography deposition technique and associated tools.

Heidelberg MLA-150 Fact Sheet

Techniques
  • Lithography
ASU Unit
Knowledge Enterprise
Rates
Service ASU Internal Rate External Organizations Notes
Equipment use $50 per Hour Contact NanoFab  
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