Heidelberg MLA-150


The MLA-150 maskless, direct-write lithography tool is used for printing resolution down to 0.6um and pattern placement accuracy of ±0.5um globally and ±0.25um with localized alignment. It is designed to handle various size and thicknesses of substrates.

Wavelength: 375 nm and 405 nm 
Resolution: 0.8 um L/S, 0.6um semi-isolated
Registration accuracy: +- 0.5 um (global), +- 0.25 um (Local)
Substrate chucks: Stage can accept 3mm x 3mm up to 200mm x 200mm; up to 12 mm thickness

Learn more about lithography deposition technique and associated tools.

Heidelberg MLA-150 Fact Sheet

  • Lithography
ASU Unit
Knowledge Enterprise
Service ASU Internal Rate External Organizations Notes
Equipment use $46.35 per Hour Contact NanoFab