PlasmaTherm Apex ICP


The PlasmaTherm Apex ICP is a load locked, inductively coupled plasma etch system. Process gases are BCl3, Cl2, O2, Ar and N2. The system is for the etching of compound semiconductors and dielectrics. Masks allowed in this system are photoresist and dielectrics.

This tool requires pre-requisite training on other techniques: PlasmaLab M80 Plus – Fluorine OR PlasmaLab M80 Plus – Chlorine OR PlasmaTherm 790 RIE – Fluorine.

Wafer Size: 150 mm wafers with one SEMI flat. Wafers smaller than 150 mm and irregularly shaped samples must be placed on a 150 mm carrier.
Platen Size: 150 mm.
ICP Power Range: 10 – 900 Watts
Bias Power Range: 0 – 900 Watts
MFC Flow Range: 0 – 100 sccm for all gases.
Pressure Range: 1 – 900 mTorr
Backside Cooling: Helium. Clamped.

Learn more about dry etch deposition technique and associated tools, such as inductively coupled plasma etching 

  • Dry etch, Inductively coupled plasma etching
Documents and manuals
ASU Unit
Knowledge Enterprise
Service ASU Internal Rate External Organizations Notes
Equipment use $46.35 per Hour Contact NanoFab  
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PlasmaTherm Apex ICP