The Tegal 421 is a barrel type photoresist asher. The process gas is O2. The system is for the for the stripping of photoresist. There are two Tegal 421 barrel ashers in the NanoFab: Tegal 1 and Tegal 2.
This tool requires pre-requisite training on other techniques: metrology.
Wafer Size: 200 mm maximum. Wafers smaller than 200 mm and irregularly shaped samples must be placed on carriers.
Power Range: < 200 W
Pressure Range: < 500 mTorr
- Dry etch, reactive ion etching, barrel ashing
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|Service||ASU Internal Rate||External Organizations||Notes|
|Equipment use||$46.35 per Hour||Contact NanoFab|