Tegal 421

Description

The Tegal 421 is a barrel type photoresist asher. The process gas is O2. The system is for the for the stripping of photoresist. There are two Tegal 421 barrel ashers in the NanoFab: Tegal 1 and Tegal 2.

This tool requires pre-requisite training on other techniques: metrology.

Specs:
Wafer Size: 200 mm maximum. Wafers smaller than 200 mm and irregularly shaped samples must be placed on carriers.
Power Range: < 200 W
Pressure Range: < 500 mTorr

Learn more about dry etch deposition technique and associated tools, such as reactive ion etching, barrel ashing.

Techniques
  • Dry etch, reactive ion etching, barrel ashing
Documents and manuals
ASU Unit
Knowledge Enterprise
Rates
Service ASU Internal Rate External Organizations Notes
Equipment use $46.35 per Hour Contact NanoFab  
We welcome industry customers! Contact us to find out our current rates.
Photos
Tegal