Tegal 421

The Tegal 421 is a barrel type photoresist asher. The process gas is oxygen (O2). The system is for the for the stripping of photoresist. There are two Tegal 421 barrel ashers in the NanoFab: Tegal 1 and Tegal 2.

This tool requires pre-requisite training on other techniques: metrology.

Specs:
Wafer Size: 200 mm maximum. Wafers smaller than 200 mm and irregularly shaped samples must be placed on carriers.
Power Range: < 200 W
Pressure Range: < 500 mTorr

Learn more about dry etch deposition technique and associated tools, such as reactive ion etching, barrel ashing.