Tegal 421


The Tegal 421 is a barrel type photoresist asher. The process gas is O2. The system is for the for the stripping of photoresist. There are two Tegal 421 barrel ashers in the NanoFab: Tegal 1 and Tegal 2.

This tool requires pre-requisite training on other techniques: metrology.

Wafer Size: 200 mm maximum. Wafers smaller than 200 mm and irregularly shaped samples must be placed on carriers.
Power Range: < 200 W
Pressure Range: < 500 mTorr

Learn more about dry etch deposition technique and associated tools, such as reactive ion etching, barrel ashing.

  • Dry etch, reactive ion etching, barrel ashing
Documents and manuals
ASU Unit
Knowledge Enterprise
Service ASU Internal Rate External Organizations Notes
Equipment use $46.35 per Hour Contact NanoFab  
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