Xactix XeF2 Si Etcher


Xactix XeF2 Si Etcher is an open load dry vapor phase etch system. The process gas is XeF2. The system is for the deep isotropic etching of silicon. Masks allowed in the system are photoresist and SiO2.

This tool requires pre-requisite training on other techniques: metrology.

Wafer Size: Designed for 100 mm. Wafers smaller than 100 mm and irregularly shaped samples can be placed directly on platen.
Platen Size: 100 mm

Learn more about dry etch deposition technique and associated tools, such as dry vapor phase etching.

  • Dry etch, dry vapor phase etching
Documents and manuals
ASU Unit
Knowledge Enterprise
Service ASU Internal Rate External Organizations Notes
Equipment use $46.35 per Hour Contact NanoFab  
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xactix XeF2