Xactix XeF2 Si Etcher is an open load dry vapor phase etch system. The process gas is XeF2. The system is for the deep isotropic etching of silicon. Masks allowed in the system are photoresist and SiO2.
This tool requires pre-requisite training on other techniques: metrology.
Wafer Size: Designed for 100 mm. Wafers smaller than 100 mm and irregularly shaped samples can be placed directly on platen.
Platen Size: 100 mm
- Dry etch, dry vapor phase etching
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|Equipment use||$46.35 per Hour||Contact NanoFab|