Xactix XeF2 Si Etcher

Xactix XeF2 Si Etcher is an open load dry vapor phase etch system. The process gas is xenon diflouride (XeF2). The system is for the deep isotropic etching of silicon. Masks allowed in the system are photoresist and silicon dioxide (SiO2).

This tool requires pre-requisite training on other techniques: metrology.

Specs:
Wafer Size: Designed for 100 mm. Wafers smaller than 100 mm and irregularly shaped samples can be placed directly on platen.
Platen Size: 100 mm

Learn more about dry etch deposition technique and associated tools, such as dry vapor phase etching.