Lesker #1 Sputter tool utilizes three magnetron guns with DC or RF energy. The sputter tool currently has the ability to sputter Ag, Al, Au, Cr, Co, Cu, Fe, Hf, ITO, Mo, Ni, Permalloy (Co/B/Zr/Ta), Si, SiC, SiO2, Ta, Ti, TiO2 and W target materials. The tool also has the ability to deposit dielectrics such as ITO, NiN, SiO2 and TiO2. The tool has a 5.5” platen, has the ability to run reactive films and has the ability to perform a pre-Ar backsputter to pre-clean substrates. This sputter tool has restrictions for Zn and ZnO materials.
- Thin film deposition
- File782.53 KB
|Service||ASU Internal Rate||External Organizations||Notes|
|Equipment use||$46.35 per Hour||Contact NanoFab|