Lesker #5 Sputter Deposition Tool

Description

Lesker #5 Sputter tool utilizes four magnetron guns with DC or RF energy. The Sputter tool has currently has the ability to sputter Al, Cr, Mo, Ni, NiN, Permalloy (Co/B/Zr/Ta), Si, Ti and W target materials.  The tool also has the ability to deposit dielectrics such as NiN and SiO2. The tool has a 8” platen, it can run reactive films and has the ability to perform an Ar back sputter clean. This sputter tool has restrictions for materials that could contaminate Silicon such as Au, Ag, Pt, Cu, Zn, ZnO and ITO.

Learn more about thin film deposition technique and associated tools.

Techniques
  • Thin film deposition
Documents and manuals
ASU Unit
Knowledge Enterprise
Rates
Service ASU rate Nonprofit/other academic rate Notes
Equipment use  $46.35 per Hour Contact NanoFab  
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