Lesker #5 Sputter tool utilizes four magnetron guns with DC or RF energy. The Sputter tool has currently has the ability to sputter Al, Cr, Mo, Ni, NiN, Permalloy (Co/B/Zr/Ta), Si, Ti and W target materials. The tool also has the ability to deposit dielectrics such as NiN and SiO2. The tool has a 8” platen, it can run reactive films and has the ability to perform an Ar back sputter clean. This sputter tool has restrictions for materials that could contaminate Silicon such as Au, Ag, Pt, Cu, Zn, ZnO and ITO.
- Thin film deposition
- File1.12 MB
|Service||ASU rate||Nonprofit/other academic rate||Notes|
|Equipment use||$46.35 per Hour||Contact NanoFab|