Osiris 1204 Coater and Developer

There is a single photoresist spinner with a programmable dispense arm motion. Automatic cassette wafer handling is standard with dual load and unload capability. The high acceleration brushless spindle motor is capable of attaining 50,000 RPM/second. The machine is currently set up to handle 100 mm, 150 mm, 200 mm, and 300 mm round wafers.  Besides positive photoresist coating, there is a top nozzle for Edge Bead Removal (EBR) and a bottom nozzle for Backside Rinse. The dispense arm can be programmed to sweep or be stationary for either photoresist dispense or EBR. The Hot Plate oven next to the resist spinner can be programmed for temperatures up to 300 C. The chemical drains into a manifold that goes into the basement collection.

The single developer chamber is a spinner cup with a pressurized dispense nozzle on top. The wafer can be either dynamic or static while developing. A DI water rinse is then used to clean the wafer after develop then spins dry. After develop and rinse the wafer travels to a hot plate oven which can be programmed for temperatures up to 300 C. 

Specifications:

Wafer size: 100 mm , 150 mm, 200 mm, 300 mm

Spindle Motor: Brushless capable from 0 to 50,000 RPM/second

Hot Plate oven: Temperatures from 0 to 300 C

Chill Plate: Chill water from facilities, 15.5 C at 60 PSI

Chemicals used: AZ5214 and MIR900 positive photoresist, Propylene Glycol Methyl Ether Acetate (PGMEA) for EBR, AZ 300 MIF developer, DI water

Resist Thickness: From 1 to 4 microns