Capabilities

Advanced Electronics and Photonics is able to assist with:

  • Thin film characterization, specifically:
    • Profile step height
    • Film thickness measurements
    • Film optical properties
    • FTIR
    • Film stress
    • Film resistivity
    • Film crystallinity
    • Contact angle
    • Film roughness
    • Defect analysis
    • FESEM
  • Thin film processing (2” – 6” wafer capability), specifically:
    • Photolithography
    • Acid and base etching
    • Reaction ion etching
    • Downstream plasma etching
    • Plasma enhanced chemical vapor deposition (PECVD)
    • Sputter deposition
    • Thermal and ion beam assisted evaporation
    • Spray coating of organic materials
    • Inkjet printing
    • Laser ablation
    • Substrate cleaning
    • AEP is capable of processing 2” wafers all the way up to a Gen II display glass sized panels, 370 mm x 470 mm
  • Device characterization
    • I-V sweeps
    • Capacitance
    • Dielectric stress
  • Device assembly
    • TAB bonding
  • Photomask design
    • GDSII output

Popular applications

  • Microelectronic device prototyping

    • Macro Technology Works can help get your electronic device prototype fabricated from design to final packaging.

  • Wafer coating or cleaning
  • Solar cell/diode optimization
  • Pilot scale product demonstration