Automated Wafer Frame Mounter 200/300mm

The Automated Frame Mounter is an integrated system that can operate as a stand alone wafer on frame mounting system. This system is designed to either take a thinned wafer from the attached Silicon Wafer Grinder or from input FOUP to remove any backgrind tape on the wafer and mount onto a mylar on ring frame for dicing processes. Mylar material and frames for mounting are integrated within tool so if specific mounting medium is requested please ensure time is allocated for change of roll of material in equipment. Automated Wafer Frame mounter is configured for handling and mounting 200 and 300mm wafer format materials.