Description
The Ball Attach System is designed to print flux and place balls onto a wafer. The system uses flux squeegee method to print flux through a flux print stencil.
The Ball Attach System has 200 mm and 300 mm wafer handling capability. Minimum size of balls: 0.05 mm. The system uses 750mm x 750mm flux ad ball drop stencils.
Techniques
- • Ball Attach
ASU Unit
Knowledge Enterprise
Rates
| Service | ASU rate | Nonprofit/other academic rate | Notes |
|---|---|---|---|