Description

Thermal warpage system. Shadow Moire to characterize out-of-plane displacement for samples up to 400mm x 400mm. Dynamic time-temperature profiling capability. Digital Image Correlation (DIC) to find XY axis strain and calculate material Coefficient of Thermal Expansion (CTE). Sub Room Temperature Module (SRM) to cool samples down to -55°C and heat up to 280°C+ reflow temperatures for reliability testing. SRM can accommodate samples up to 200mm x 200mm. Samples must be non-reflective.