Description
The Compression Molding System is designed to fabricate mold wafers up to 300 mm from a granular and liquid mold compounds. The system is designed to operated at elevated temperatures with compression up to 800 kN. As a standard, the system is equipped with the mold chase (flange mold) to produce 300 mm mold wafers. The second mold chase (flange mold) is available for use and able to handle 300 mm Si and glass wafers with a V-notch.
The compression Molding System includes:
- Standalone compression mold system.
- Standalone automated granular dispense station.
- Standalone automated liquid mold dispense station.
Techniques
- Compression Molding
ASU Unit
Knowledge Enterprise
Rates
| Service | ASU rate | Nonprofit/other academic rate | Notes |
|---|---|---|---|