This high temperature cure oven is used to cure Polyimide or ILD films on substrates. It uses a nitrogen (N2) purge to create an inert atmosphere during the cure. It has a class 100 HEPA filter installed to keep particulates low.
Specifications:
Chamber size: 25.5” W x 26” D x 37” H
Capacity: 14 cubic feet
Max Load Capacity: 400 lbs
Volts: 208
Amps: 50.5
Phase: 3
Hertz: 50/60
Heater: 16 KW
Max Temp: 350 C
Temp Uniformity +/- 3.5 C
Model No. LCD2-14NV-3
For a typical recipe, specify the time needed to ramp up to temperature and how much inert gas needs to be induced to ensure a stable atmosphere and temperature in the oven, the soak time, the length of time for the cure and the length of time for the cure.
- Photolithography
- File
