Description
The Die/Chip Attach System is designed for PnP of small dies and components with a high accuracy from a source substrate onto a target substrate. The system is equipped with front and rear gantries allowing a high degree of PnP program recipe customization. The system is equipped with integrated uplook and downlook optical cameras to ensure a high level of accuracy and defect detection.
Multiple toolsets and pick nozzles are availabe to pick dies/chips as small as 2mm x 2mm.
The pick is available from:
- Wafer ring frame
- Waffle pack
- Tape & Reel
Techniques
- Die attach
- Chip attach
ASU Unit
Knowledge Enterprise
Rates
| Service | ASU rate | Nonprofit/other academic rate | Notes |
|---|---|---|---|