Description
Laser Groove is a direct laser dicing and ablation tool which consists of an automated cassette and wafer handler, spin coater, laser dicing, and cleaning station. During process as a dicing process all materials incoming must be mounted onto 300mm wafer ring frame with dicing tape with cassette or cassette FOUP for loading parts into equipment. Process flow of workpiece within equipment is spin coat application and cure of flux material, direct laser processing using short pulse laser (kHz range) and final cleaning of workpiece.
If workpiece mounting is needed as part of request will need to either manual mount or request mounting on Automated Wafer Mounter 300mm.
Techniques
- Low-k ILD ablation
- Silicon Laser ablation
- Silicon Laser Dicing
- Silicon Laser Grooving
ASU Unit
Knowledge Enterprise
Rates
| Service | ASU rate | Nonprofit/other academic rate | Notes |
|---|---|---|---|