Description
The MRC-603B is a sputter system for 6-inch wafer designed to deposit thin film metals by DC source. The MRC-603B can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti.
Techniques
- Thin film metal deposition
ASU Unit
Knowledge Enterprise
Rates
| Service | ASU rate | Nonprofit/other academic rate | Notes |
|---|---|---|---|
| Equipment use | $30/hour | $36/hour |
We welcome industry customers! Contact us to find out our current rates.
