The MRC-603B is a sputter system for 6-inch wafer designed to deposit thin film metals by DC source. The MRC-603B can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti.

  • Thin film metal deposition
ASU Unit
Knowledge Enterprise
Service ASU rate Nonprofit/other academic rate Notes
Equipment use  $30/hour $36/hour  
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