This is a single track dispense photoresist spinner with a programmable dispense arm motion. Automatic cassette wafer handling is standard with dual load and unload capability. The high acceleration brushless spindle motor, is capable of attaining 50,000 RPM/second. The machine is currently set up to handle 6 inch wafers. Besides positive photoresist coating, there is a top nozzle for Edge Bead Removal (EBR) as well as a bottom nozzle for Backside Rinse. The dispense arm can be programmed to sweep or be stationary for either photoresist dispense or EBR. The Hot Plate oven next to the resist spinner can be programmed for temperatures up to 300 C. The chemical drain is into a manifold that goes into the basement collection.
The single track developer is a spinner cup with a pressurized dispense nozzle on top. The wafer can be either dynamic or static while developing. A DI water rinse is then used to clean the wafer after develop then spins dry. After develop and rinse the wafer travels to a hot plate oven which can be programmed for temperatures up to 300 C.
Wafer size: 6 inch
Spindle Motor: Brushless capable from 0 to 50,000 RPM/second
Hot Plate oven: Temperatures from 0 to 300 C
Chill Plate: Chill water from facilities, 15.5 C at 60 PSI
Chemicals used: AZ5214 and MIR900 positive photoresist, Propylene Glycol Methyl Ether Acetate (PGMEA) for EBR, AZ 300 MIF developer, DI water
Resist Thickness: From 1 to 4 microns
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