Semi-Automated Debonder/Backside Laminate with Integrated Laser Mark

Semi-Automated Debonder/Backside Laminate system is designed to remove molded wafer from a metal carrier. The system is equipped with an automated debonding and detaping unit allowing elimination of manual handling. The system is capable of scribing a laser 2D mark using a green laser. Additionally, the system is accompanied by the lamination module capable of laminating 300 mm molded wafers.