Silicon Wafer Grinder 200/300mm description pricing

Silicon Wafer Grinder is a mechanical grinding and polishing tool which consists of an automated FOUP handler, chuck table, Z1 (rough) and Z2 (fine) grind stations, and Z3 dry polishing station.  During process flow equipment will receive wafers from FOUP and transfer from Z1 --> Z3 stations based upon programmed recipe settings to grind wafer to desired target thickness.  For thin wafer processing and downstream dicing Silicon Wafer Grinder has integrated wafer mounting and detaping equipment to allow for mounting onto frame without need for handling wafer outside of grinding equipment.
For using integrated wafer mounter with grinder please combine requests to ensure both equipment available.

Silicon grinder is configured to be able to handle 200mm or 300mm wafers.

Silicon grinder is not configured for grinding materials with metals such as Cu in removal area.  For grinding non-silicon materials request for Composite Material Wafer Grinder 200/300mm.