Thermal Reflow Oven

Thermal reflow oven is equipped with 6 heating zones allowing a high degree of thermal reflow profile customization to achieve desired key process parameters. Heating is achieved through thermal conduction from 7 hot plates. N2 gas flow allows the oven to achieve O2 < 20 ppm and improve heating uniformity. The wafer is cooled through a process cooling wafer line.

Thermal reflow oven can handle wafers up to 300 mm in diameter. Processing smaller samples is achievable after, however thermal reflow profiling needs to be performed for a specific sample.