The CHA Metal Evaporator is a bell jar-style e-beam evaporator for metals. The turret consists of six pockets, each with a 15cc volume. The system is equipped with automatic deposition rate and thickness control, including multilayer process programming, ex. titanium/nickel/gold. It has a rotating dome configuration, capable of 2” through 6” round substrates. Pieces, parts, and variable shapes may also be processed using custom fixturing. Gold (Au) and copper (Cu) usage is permitted in the CHA metal evaporator.
If your devices are sensitive to Au and/or Cu contamination, please consider using the neighboring CHA TCO evaporator, found at the following hyperlink:
- e-beam evaporation