Description
                  The MRC-603A is a sputter system for 6-inch wafer designed to deposit thin film metals by DC source. The MRC-603A can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), tantalum (Ta), and molybdenum (Mo) for single or multi-stack films like an Al/Ta/Al.
Techniques
    - Thin film metal deposition
 
Documents and manuals
          - FileMRC-603A specifications.doc25.49 MB
 
ASU Unit
                  Knowledge Enterprise
            Rates
                  | Service | ASU rate | Nonprofit/other academic rate | Notes | 
|---|---|---|---|
| Equipment use | $44/hour | $58/hour | 
Photos