Description
The MRC-603A is a sputter system for 6-inch wafer designed to deposit thin film metals by DC source. The MRC-603A can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), tantalum (Ta), and molybdenum (Mo) for single or multi-stack films like an Al/Ta/Al.
Techniques
- Thin film metal deposition
Documents and manuals
- FileMRC-603A specifications.doc25.49 MB
ASU Unit
Knowledge Enterprise
Rates
Service | ASU rate | Nonprofit/other academic rate | Notes |
---|---|---|---|
Equipment use | $44/hour | $58/hour |
Photos