The MRC-603A is a sputter system for 6-inch wafer designed to deposit thin film metals by DC source. The MRC-603A can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), tantalum (Ta), and molybdenum (Mo) for single or multi-stack films like an Al/Ta/Al.

  • Thin film metal deposition
Documents and manuals
ASU Unit
Knowledge Enterprise
Service ASU rate Nonprofit/other academic rate Notes
Equipment use $40/hour $36/hour  
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